It's not so recently; the boom appeared to the problem of heat dissipation in microprocessors, memory chips, graphics, audio, etc. In the PC. The user and computer aficionado finds himself lost among so many supply of materials, designs, aesthetics and price.
Clearly the proliferation of all copper sinks made even completely in pure silver. We assess whether improvements in terms of thermal conductivity that provide each other should make us rule out the use made of aluminum or aluminum with copper base.
The purpose of this essay is to reconsider the efficiency of the latter to not forget its main advantages are the cost of production and especially its low weight. Regarding this last factor-dissipating fans to see microprocessors reach values in excess of 700g much higher than recommended for example by the manufacturer AMD. This weight can pose a risk to the buses or the base where they are attached, especially if the PC is moved without prior dis assembly.
Regarding the building materials we see some numbers on their thermal characteristics-called noble metals have in general better thermal conductivity characteristics, others such as lead or iron. But this claim is not strict as we shall see.
For example the thermal conductivity of platinum is very low and gold is lower than that of copper or silver. Therefore we can say that metals would be ideal in this order Plata Coppe if we discard the gold because of its prohibitive cost for these applications, and aluminum .Aluminum is also therefore a good driver despite being a common and abundant metal.
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