Thread: Intel Sandy Bridge: Informations of the following "Era"

We have acquired details in front of us of Intel's following era programs due in 2011, along with its 'Sandy Bridge' central processing unit. A third party gave us this data - Intel would not point out on unreleased products.


Sandy Bridge central processing unit will be founded on the recent 32nm, second era High-k metal gate manufacturing function, but will add fresh architectural features such as AVX - Advanced Vector Extensions - and AES - Advanced Encryption Standard - quickening and will arrive in QOne following year, with perhaps so limited products popping up late QIV, although depending on who we talk to the story alters.


They will be split into 2 markets: conventional and enthusiast. The mainstream example will substitute the recent LGA1156 'H1' Clarkdale and Lynnfield central processing unit (Core iIII and Core iV) and will utilize LGA1155 'HII' packaging.


Yes, that is right, LGA1155 - one fewer pins than recent LGA1156 central processing units. These sockets are NOT compatible, so you cannot utilize an existing LGA1156 central processing unit in a fresh CPU board or visa verse. Not only is the situation of pin-One different, the socket notch has impressed from 9mm to 11.5mm from the centre and the full voltage plane layout has altered.




Mainstream Sandy Bridge central processing units will be together native double- and quad-core products, recently targeting TDPs of 65W and 95W respectively, together with Hyper-Threading and Turbo Boost tech. At the moment it is not clear what frequency these central processing units will be though (probably because none are available still from Intel).


Complete LGA1155 central processing units will have incorporated graphics construct into the core rather of a break chip. This is an upgrade from the recent IGP, PCI Express controller and storage controller in Clarkdale central processing units that is constructed on the more former 45nm process in a break die (but even slapped both the similar package). This should improve function, as entire the controllers will be in one die, similar existing LGA1366 central processing units.


The PCI Express controller in build in the central processing unit will furnish 16 lanes, but it will be multi-graphics processing unit x8-x8 compatible similar recent LGA1156 central processing units - however there are recently no particular points about SLI or CrossFire.


The LGA1155 central processing units will have an incorporated double-channel DDRIII memory controller, utilizing the similar 1,333MHz memory recently available: no alter there then.