According to the image with some info that we managed to grasp out of them, Mushkin is functioning on a newest heatspreader that will be a solution for the latest future Copperhead memory kit series. The statistics on it is still appealing much inadequate as Mushkin is somewhat eager about the new series.

We must concur that those blocks on top of the memory modules look actually superior, as well as according to what we managed to hear, the looks is not what it's all about, as well as we acquire the feeling that the new-fangled kit may be somewhat a performer. Mushkin plans to make use of it on its high-end parts, so we suppose that it does a good job in keeping the heat on the memory ICs reasonably low.

In fact, the new-fangled Copperhead series will contain both DDR2 as well as DDR3 memory with all the well-known configurations, like dual, triple, quad, hex as well as perhaps even oct kits. The cost as well as the date of release is still unidentified but we will attempt to get more statistics on these as soon as we are able to.

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