The source reports that the factory GlobalFoundries, known as Fab 1, located in Dresden, started the test production of 32nm 300mm wafers, for cores and memory chips. Process Technology will be ready for customers around the middle of 2010, but since AMD currently is the sole partner of the GF, which will require process technology 32nm SoI from the norm, well ahead of schedule GF events, and AMD will release 32nm products until 2011 year. This fact depends entirely on the plans of AMD, and the willingness GlobalFoundries to an earlier release of 32nm wafers nothing will not help. Nevertheless, it is too early to talk about the percentage of output. The transition to 32nm will be quite tough, the manufacturer will need to make still smaller transistors, to reduce the distance between them and solve many related problems. This is not as easy as it might seem.

GlobalFoundries let journalists in the holy of holies, in a pilot plant, which is working on 32nm process technology. Representatives of the GF showed no equipment associated with development of 28nm process technology, but the vice president of AMD Nothelfer Udo confirmed that the Dresden factory is preparing for mass production of 45nm and more important 28nm bulk process technology. These two process technology attracted the greatest interest, and perhaps the mass production of this process technology should not be for GlobalFoundries a big problem, because in principle no more complicated bulk SoI, which for many years made AMD processors.

Risk production on 28nm process technology should begin in late 2010, probably in the fourth quarter, and the first scheduled release on this process technology chips for high-performance complex graphics. It is safe to say that the 28nm chips is interested in the AMD / ATI, nVidia, and a manifestation of the company keen interest in GF ─ just a matter of time.