Antec Company prepares to release a new air ATX case Lanboy Air. The new building will be one of the attractions Antec booth at CES 2010, which is expected to announce this building. Athletic design looks very modular, and, apparently, if they wish, users will be able to completely dismantle it. Several panels, it seems, are connected with each other, and the user can actually simulate the panel, depending on their goals. Each panel has a steel mesh to ensure a strong flow of air. This, combined with black-gray-yellow design gives the body a few productive species.

Future Antec case has three 5.25 "bays for optical drives, nine slots for drives, eight expansion slots for configuration 3-way SLI, two 120mm fans, which are a little stand, and the usual connectors on the front panel. On the side panel near the drive bays have Two or three 120mm fans, two more just above the area of expansion slots. The top panel is also perforated, with room for two 120mm fans, in addition, another fan is located, as usual, on the rear panel. The user can optionally add to the original configuration up to seven fans. In this case you can install motherboards formats, mini-ITX, microATX, as well as standard fees ATX. Prior to the announcement Lanboy Air Corps remained about two months, presumably, its price will be approximately € 200 per batch of 1000 pieces.

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