32nm process technology produced with the integrated graphics feature the new generation Core processors, i3 and i5 Core Intel prepares to announce a new processor chipset for H57 has developed a new chipset. P55 which has similar features but çipsetiyle integrated graphics processor unit for the FDI (Flexible Display Interface) named to the new interface created to support the new Asus model for the H57 to light output.

EVO named as the innovative Asus P7H57D-V motherboard with 32nm process technology to set up all of the desktop processor will support. Using four DIMM slots in high-speed dual-channel DDR3 memory kit can work with dual PCIe x16 slot on the motherboard are included Nvidia SLI and ATI Crossfire X (?) Technology is expected to be supported.

Printed circuit, color components and custom design an eye-catching looks cooler with the new motherboard, USB 3.0 and SATA-III also provides support for next-generation technologies such as. A new generation of Intel integrated graphics processor, code-named Clarkdale unit for use DVI, VGA and HDMI outputs with the motherboard at the same time 6x SATA, eSATA and FireWire also brings out.

EVO series under the mainstream segment of preparation for Asus motherboards, chipsets more advanced model H57 is expected to prepare, the new motherboards are expected to be launched in January.