Intel's annual Developer Forum was the venue for a number of announcements and unveilings that together outline the company's plans for the coming year. The most important consumer products in focus were the first mobile variants of Intel's Nehalem microarchitecture, till now seen only in high-end desktop CPUs. The first Core i7 Mobile chips will be available in regular and Extreme editions, bringing benefits such tiS an integrated memory controller and Turbo Boost intelligent clock speed adjustment to laptops for the first time. Demonstrations of gaming and high-end machines from Alienware, Asus and Toshiba were' shown.

Plans for future Nehalem, Westmere and Sandy Bridge chips were, also outlined, along with updates on Intel's 32-nm manufacturing process. A new System-on-a-Chip (SoC) platform called Jasper Forest, based on Atom CPUs, will enable a new level of miniaturization and control for embedded appliances. A laptop concept with three small OLED screens below the main screen was also demonstrated, though there were few details about it ever going into production.

A new high-speed interconnect called Light Peak was announced for the first time. Light Peak will adapt optical cable technology for use in connecting devices such as hard drives, displays, docking stations, etc at Gigabit per second speeds. Components are expected to show up in devices within a year. USB 3.0 products were also demonstrated, indicating release dates in the near future for them.
Finally, Intel's future hybrid CPU-GPU star Larrabee was also shown off. Working samples are already in developers' hands, The first actual product will be a discrete graphics chip sometime in 2010.