Thread: VIA announces mobile-ITX form factor 6x6cm

The market for low-power processors and computer circuits is perhaps hotter than ever and it is an actor who has an eye on this as it is CPU manufacturer VIA. It has for many years, fed on the launch of processors and circuits for the integrated market and less performance demanding applications where power consumption and heat generation are higher on the priority list.

As usual the PC market is shrinking VIA has begun to shrink their already minimalist platform even more, this time through the mobile-ITX form factor.

The entire platform measuring 6 x 6 cm and is a so-called Computer-on-module platform. With its dimensions are mobile-ITX 50% less than pico-ITX form factor, the VIA undeniably created a space-saving platform based on VIA VX820 media processor with an extremely low power C7-M ULV CPU.

By plugging into the CPU module in a so-called I / O carrier card may also extend the platform's functionality easily. VIA sees among military, medical and robotics industries suitable markets for its new mobile-ITX form factor.