Toshiba has announced the launch of the world's first module built-in NAND flash memory capacity of 64GB. The new module is a high capacity, shown in photographs, is fully compatible with the latest standard eMMC, partners will supply samples of the module manufacturer has already begun. As expected, the mass production of new modules, flash memory will begin in the first quarter of 2010, as market devices with these modules will appear somewhere in the beginning of next year.

Using 32nm process technology, Toshiba has condensed sixteen 32Gbit (4GB) NAND Flash chips and built-in controller housing FBGA 14h18h1.4mm. The producers used the "advanced technology thinning and separation of the chip to create the flash chip thickness of 30 microns (about two times thinner than a hair).

For users of the emergence of new memory chips will lead to the emergence of models of existing products with increased capacity. In a number of modern smart phones used by the previous generation Toshiba chips, modules, NAND flash memory capacity of 16GB and 32GB. One can assume that many smartphone manufacturers are already working on models with 64GB memory chips.