Thread: New motherboard chipset and USB 3.0 support Gigabyte H57: H57M-USB3

The first time in the industry with integrated graphics processors feature Intel preparing to bring to market new processors with the new H-series chipset family will be introduced. General features with similar features as P55 çipsetiyle the H-series chipsets will be pondering over the fundamental differences, the FDI (Flexible Display Interface), which can be shown to support Flexible Display Interface. 32nm process technology code-named the new generation of prepared Clarkdale Core processor, integrated graphics features of i3 and i5 Core for FDI support needed and this requirement can be met ie only chipsets such as H55 and H57. At this point, the new processors are compatible only motherboards using the P55 motherboards integrated graphics unit will remain off to indicate there also benefit.

H55M details about the chipset model H55-UD2H we share for the first time Gigabyte, many new models for 32nm Intel processors in January with plans to bring to market. The company's plan to meet with users at another of the new motherboard model GA-H57M-USB3. Micro-ATX forms a new chipset which H57 motherboard, LGA 1156 is presented in the form of support to all Intel processors. Four DIMM slots for dual-channel DDR3 memory support, offering over H57M-USB3, Ultra Durable III technology in the context of increased density of 2oz copper printed circuit board design, Japanese manufactured solid capacitors and Dual BIOS technology. Multiple video card setups, and for two PCIe x16 ATI Crossfire X supports the slot motherboard with USB 3.0 support is remarkable.

NEC provided by the controller chip connected to two USB 3.0 connectors equipped with an additional piece on the Gigabyte H57M-USB3 eSATA, FireWire and SATA-II seven wire connector is located. Dynamic Energy Saver 2 technology performance with energy efficiency is targeted by a new motherboard, processor, and integrated graphics unit will use the HDMI, DVI and D-Sub connectors are also included. Other features 8-channel high-definition audio support, and to detail such as Gigabit Ethernet location data of the USB 3.0 support in January H57M-USB3 model is expected to be available for sale price is currently unknown.