At CES 2010, which will be held from 7 to 10 January next year, the company will Thermaltake than boast. Among the new products that the manufacturer intends to present, is the next flagship products, called Frio, designed to cool the processor. The new Thermaltake cooler, as shown in the picture, made in the form of a tower of aluminum plates with thickness 0.05mm, planted five 8mm U-shaped copper heatpipes. The plates are cooled by the radiator 120mm VR fan, who works at the speed of 1200ob/min to 2500ob/min.

Frio cooler supports all new sockets, including Intel LGA 775, 1156, 1366 and AMD AM2, AM2 +, AM3, and probably others, but this reliably yet known, so that until more specific data will have to wait for CES, is a fairly simple task in view of upcoming festivals. By the way, with the Catholic Merry Christmas to all!