For some time that Thermaltake had further attempted to recover the performance crown from the side of the heat sink. The Taiwanese company will try to fix this by launching a new monster, codenamed Frio, in the CES in Las Vegas. This solution adopts a format around, with five heat pipes of 8 mm, folded in U, and many strips of aluminum 0.05 mm thick.

A 120mm fan will evacuate the residual heat; it will run between 1200 and 2500 rounds per minute. The Thermaltake Frio will be compatible with Intel socket LGA 775, 1156 and 1366 and the AMD AM2, AM2 + and AM3. If it was not until the first tests to judge performance, we must admit that looks level, it is rather successful. See you in next weekend for more details.

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