While Samsung, TSMC and Intel are trying to promote the establishment of factories capable of producing 450 mm wafers by 2012, costs Pharaonic this technology would probably delay his arrival.

Adverse Events

While the demonstrators for the first 450 mm wafers are expected to use a fine engraving of 32 nm, and machinery costs in research and development are so important that more and more rumors that we will see no such wafers by 15 nm. If the great founders are enthusiastic, suppliers have difficulty sustaining this technology is still difficult to implement and were delayed because of the economic crisis.

A technology too risky and too expensive

We recall that the transition between the wafers of 200 mm and those of 300 mm was also painful, but productivity has increased 2.6 times. However, some analysts have trouble believing that 450 mm is beneficial that the 300 mm in time to cover investments, which makes markets even more hesitant. In addition, the founders continue to improve technology on the 300 mm and prefer to maximize existing resources rather than taking a gamble, which has prompted the CEO of equipment manufacturer Novellus System to report the death of 450 mm. In short, 2012 appears to compromise.