Thread: TSMC will start development of 28nm process technology in the third quarter of 2010

Recently, Taiwan Semiconductor Manufacturing Company (TSMC) held a ceremony at the headquarters in northeast Taiwan to mark the completion of Phase 5 development of the production of 12 "plates at the facility" Gigafab ", more commonly known as Fab 12. In other words, this year the manufacturer expects to a large number of research and development in advanced lithography to 28nm and 22 nm process technology, after the new line will work.

TSMC announced that its line with the phases 4 and 5 on Feb 12 is specifically designed for research and development, as well as for the initial mass production. The company already conducts research and development using 28nm and 22 nm technical processes in phase 1 and phase 2, and in the fourth quarter of 2010 plans to begin mass production in phase 5. But before that, in the third quarter of 2010, will begin production of 28nm hands-on new lines in phase 5.

"The Feb 12 will be phase 5, and we plan to rapidly move the component as well as begin the mass development in the third quarter of 2010, which is one more situations of our competitiveness in offering solid customer support", ─ "said Mark Liu (Mark Liu), a senior vice TSMC President, Operations. Next on Feb 12 is planned to develop phase 6, which will primarily be used for research and development on 22 nm process technology.

In addition, Mark Liu said that TSMC has enhanced the development of 40 nm technological processes and at present the quality of 40 nm wafers approximately the similar level with the quality of 65nm wafers. Liu alleged that the attendant issues that affect the yield 40 nm chips have been solved. Details Liu did not specify.