Thread: Intel wants to get rid of the infrared oven

Intel as well as the Carnegie Mellon University in the U.S are being operational on magnetic nanocomposites solder (lead magnetic nanocomposites), a class of substance that would abstain from oven all through packaging.

The problem of the oven at the Electronic Packaging

After building a wafer plus have die cut the equivalent spot on the chip in a package that will protect as well as carry out heat outwards. To acquire this step, we make use of a convection oven or else infrared model. The trouble is that these techniques need substantial energy as well as sometimes they deform the chips, building them unusable.

Using radio frequency and magnetic technologies

To overcome this problem, Intel and researchers at the University located in Pennsylvania have devised a system using the magnetic field of radio frequencies that pass through a coil to heat and optimized magnetic particles mixed with a solder, a metal alloy that is used to bind metals. It does not heat so that what needs to be welded to the package instead of the entire chip. By changing the composition and concentration of magnetic particles, researchers can also control the time it takes to heat them. In addition to saving energy, this technique allows not to lead, what a significant environmental argument.

We are still far from widespread use, but such research remains promising and was presented at the Conference Magnetism and Magnetic Materials, held in Washington DC last week.