Toshiba America Electronic Components Inc. declared plans to send 128GB embedded NAND flash memory module, highest ability available for smart phones, tablet PCs and digital video cameras. The module has 46MB/sec. read speed and a 21MB/sec. write speed.

New NAND flash memory module available in samples for mobile tools manufacturers in September, with mass production starting in fourth quarter of year. Latest samples of chips with 64GB capacity available in August.

Module stacks 16 64Gbit NAND chips fictional using 32-nanometer lithography process, which permitted Toshiba to fit it and a devoted controller into a little package, 0.66-inch wide by 0.86-inch long, and .05-in thick. The single NAND chips are only 30 micrometers thick. A micrometer is similar to one-millionth of a meter.

Toshiba said it is first company to effectively join 16 64Gbit NAND chips using advanced chip thinning and layering technologies. Its line of embedded flash modules now presents capacities ranging from 2GB to 128GB.