Thread: Ball Grid Array

A Ball Grid Array (BGA) package is similar to a PGA (Pin Grid Array) package, except that the role of the pins is taken over by small balls of conductive material. The advantage is that unlike pins, the conductors are not easily bent. Unfortunately, BGA CPUs A BGA-packaged chip are soldered right onto the motherboard, and users cannot replace them. This form of packaging is seen in embedded CPUs like those from VIA.